TMS Test Services provides engineers with a cost-effective solution for RF semiconductor characterization. Our engineers will help you develop your test plan, collect data on your wafer, package or assembly, and consult with you on the results. Leverage our collective 70 years of on wafer RF test and automation experience to improve your design.
Measurement Capabilities:
- DC Screening (DCIV)
- On Wafer, On PCB, or Connectorized
- Fixture development
- S parameter measurements
- Device characterization
- Design validation
- Model characterization/ validation
- Assist with on-wafer calibration structures
- Packaged Fixture design
- Software automation tools- Z tools
- DCIV
- S parameter toolkit
- (Coming Soon):
- Power Load Pull
- Fixture design for packaged devices
- Fundamental source, second harmonic load, CW and pulsed
- On Wafer Load Pull- 67 GHz
- Source: fundamental, second and third harmonic
- Load: fundamental, second and third harmonic
Lab Setup:
- 8″ and 6″ semi- automated wafer probing stations with -55 to 200 degree thermal capability
- Labview
- Wincal
- Assorted cables, probes to support 40 GHz+
- Access to a wide variety of test equipment to support your test plan
- Customer Lockable storage